Supplemental Material, Isothermal_DSC - Properties of high-temperature epoxy/DDS resin systems for bonding application

Supplemental Material, Isothermal_DSC for Properties of high-temperature epoxy/DDS resin systems for bonding application by Haoran Zhou, Xupeng Fan, Changwei Liu, Chunyan Qu, Zhen Yuan, Jiaqi Jing, Yao Tang, Daoxiang Zhao, Wanbao Xiao and Kai Su in High Performance Polymers