Supplemental Material, Isothermal_DSC - Properties of high-temperature epoxy/DDS resin systems for bonding application
Haoran Zhou
Xupeng Fan
Changwei Liu
Chunyan Qu
Zhen Yuan
Jiaqi Jing
Yao Tang
Daoxiang Zhao
Wanbao Xiao
Kai Su
10.25384/SAGE.10999727.v1
https://sage.figshare.com/articles/figure/Supplemental_Material_Isothermal_DSC_-_Properties_of_high-temperature_epoxy_DDS_resin_systems_for_bonding_application/10999727
<p>Supplemental Material, Isothermal_DSC for Properties of high-temperature epoxy/DDS resin systems for bonding application by Haoran Zhou, Xupeng Fan, Changwei Liu, Chunyan Qu, Zhen Yuan, Jiaqi Jing, Yao Tang, Daoxiang Zhao, Wanbao Xiao and Kai Su in High Performance Polymers</p>
2019-11-23 13:10:43
Epoxy
high-temperature adhesives
structure–property relations
thermal analysis